Details about the next version of Apple's iPhone, said to be called the iPhone 6S, has started to leak with a set of images showing an upgrade to the flagship smartphone's wireless chip.

9to5Mac.com revealed images that show the redesigned logic board for the new iPhone and the new Qualcomm MDM9635M LTE Chip, also called the 9X35 Gobi Modem platform. This new silicon, which first debuted on the Samsung Galaxy S5, is said to be able to reach up to 300 Mbps download speed, doubling the present capacity of the chip found in the current iPhone lineup. However, actual download speeds will depend on the carrier's capabilities. Qualcomm however assured that the new wireless chip will still be backwards compatible and can work with all major wireless technologies and standards.

Along with the improved download speeds, the new Qualcomm radio chip on the upcoming iPhone is said to be more power-efficient than its predecessor, which translates to improvements in battery life for the handset.  Because it was made using a 20nm manufacturing process, the 9X35 is also said to be slightly smaller , thus saving on board space. Apple is likewise rumored to have slimmed down the new iPhone's motherboard, ostensibly to accommodate a larger battery pack.  

Mashable meanwhile argues that Apple will not make radical changes to the look of its flagship smartphone model, saying that the iPhone is on an "S" cycle this year, meaning that changes will focus on internal upgrades rather than external ones.  According to the site, the new iPhone will not sport a dual-lens camera, and the opening for the camera, microphone and LED flash are still in the same spots. This means that accessories for the iPhone 6 and 6+ will probably still work with the upcoming iPhone version.

Finally, Bloomberg reports that the new iPhone will share the Force Touch feature with the Apple Watch, allowing the new iPhone to sense how hard the user presses down on the screen.